Memory card

ABSTRACT

On an adapter mounting portion  3   a  having a projecting cross section which is formed on a cap  3  of a small-sized memory card  1 , a recessed portion of an adapter  2  side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card  1  can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card  1  can be used also in equipment which is designed to cope with the existing memory cards.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 10/267,784filed Oct. 10, 2002, which is a division of application Ser. No.10/240,187 filed Sep. 30, 2002(now U.S. Pat. No. 6,858,925 issued Feb.22, 2005), which is a 371 of PCT/JP01/11640 filed Dec. 28, 2001.

TECHNICAL FIELD

The present invention relates to a semiconductor device and a method ofmanufacturing the same, and more particularly to a technique which canbe effectively applied to a semiconductor memory card (simply referredto as “memory card” hereinafter), for example.

BACKGROUND ART

A memory card such as a multimedia card (produced by Sun Disk Inc.) or aSD card (produced by Panasonic, Toshiba Corporation, Sun Disk Inc.) isone of a storage device which stores information in a semiconductormemory chip housed in the inside thereof. This memory card can directlyand electrically get access to information with respect to anon-volatile memory formed in the semiconductor memory chip.Accordingly, the memory card exhibits faster writing and readingcompared to other storage device by an amount corresponding to theabsence of a mechanical system control and further enables the exchangeof storage mediums. Further, since the memory card is relativelyminiaturized in shape and light-weighted, the memory card is mainly usedas an auxiliary storage device of equipment which is requested tosatisfy portability such as a portable personal computer, a portabletelephone set or a digital camera. Recently, the miniaturization of theequipment is still in progress and hence, the further miniaturization ofthe memory card is requested along with such progress. Further, sincethe memory card is a novel technique, the dimensional standard has notbeen completely unified.

However, when the size of the memory card is to be reduced or the sizeof the memory card differs between countries, the manner how to maintainthe compatibility in size with existing memory cards and the manner howto use the memory card with respect to equipment which are devised forexisting memory cards constitute serious tasks.

The object of the present invention lies in providing a technique whichcan enhance the versatility of semiconductor device.

The above-mentioned and other objects as well as novel features of thepresent invention will become apparent from the description of thisspecification and attached drawings.

DISCLOSURE OF THE INVENTION

To briefly explain representative inventions among inventions disclosedin this specification, they are as follows.

That is, the present invention is characterized by providing a mountingportion having a projecting cross section to a resin-made case bodywhich incorporates a semiconductor chip, wherein a metal-made auxiliarypiece for changing a planar size of the case body can be replaceablymounted on the case body by fitting a recessed portion of the auxiliarypiece on the mounting portion.

Further, the present invention is characterized in that the resin-madecase body covers a part mounting surface of a substrate on which asemiconductor chip is mounted, and the substrate has an area which isequal to or less than one half of a planar area of the resin-made casebody.

Further, the present invention is characterized by having a step inwhich a case body which covers a part mounting surface of a substrate onwhich a semiconductor chip is mounted is molded using a mold in which adepth of cavity of a lower mold is greater than a depth of cavity of anupper mold.

Further, the present invention includes a case body, a groove formed inone surface of the case body, a substrate which is mounted in a statethat a part mounting surface thereof faces the inside of the groove, anda plurality of semiconductor chips mounted on the part mounting surface,wherein a length in the longitudinal direction of the case body at thegroove and the substrate is set shorter than a total length in thelongitudinal direction of the case body, and in the substrate and thegroove, corner portions which are positioned at the center of the casebody are chamfered.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a semiconductor device and an auxiliarypiece which constitute one embodiment of the present invention.

FIG. 2 (a) is a perspective view showing an appearance of a frontsurface-side of the semiconductor device shown in FIG. 1, and FIG. 2 (b)is a perspective view showing an appearance of a rear surface-side ofthe semiconductor device.

FIG. 3 (a) is a plan view of a front surface side of the semiconductordevice shown in FIG. 1, FIG. 3 (b) is a side view of the semiconductordevice shown in FIG. 3 (a), FIG. 3 (c) is a back view of thesemiconductor device shown in FIG. 3(a), and FIG. 3 (d) is a plan viewof a rear surface-side of the semiconductor device shown in FIG. 3 (a).

FIG. 4 (a) is an enlarged cross-sectional view of an essential part ofan auxiliary piece mounting portion in the longitudinal direction of thesemiconductor device shown in FIG. 1, and FIG. 4 (b) is an enlargedcross-sectional view of an essential part of the auxiliary piecemounting portion in the lateral direction of the semiconductor deviceshown in FIG. 1.

FIG. 5 (a) is a cross-sectional view taken along a line A-A in FIG. 3(a), and FIG. 5 (b) is an enlarged cross-sectional view of an essentialpart of FIG. 5 (a).

FIG. 6 is a plan view of a base substrate of the semiconductor deviceshown in FIG. 1.

FIG. 7 (a) is a plan view of a front surface side of an auxiliary baseportion shown in FIG. 1, FIG. 7(b) is a side view of the auxiliary pieceshown in FIG. 7(a), FIG. 7(c) is a back view of the auxiliary pieceshown in FIG. 7(a), FIG. 7(d) is a plan view of a rear surface-side ofthe auxiliary piece shown in FIG. 7 (a), and FIG. 7 (e) is an enlargedcross-sectional view of essential parts of a pawl portion and a supportportion of the auxiliary piece shown in FIG. 7 (a).

FIG. 8 (a) is a plan view of front surfaces of the semiconductor deviceand the auxiliary piece shown in FIG. 1, FIG. 8 (b) is a side view ofFIG. 8 (a), and FIG. 8 (c) is a plan view of a rear surface of FIG. 8(a).

FIG. 9 (a) is a plan view of a front surface of an existing full-sizesemiconductor device, FIG. 9 (b) is a side view of FIG. 9 (a), and FIG.9 (c) is a plan view of a rear surface of FIG. 9 (a).

FIG. 10 (a) is an enlarged cross-sectional view of an essential part ofa bonding portion between an auxiliary piece pawl mounting portion ofthe semiconductor device in the state shown in FIG. 8 and the pawlportion of the auxiliary piece, and FIG. 10 (b) is an enlargedcross-sectional view of an essential part of a bonding portion betweenthe auxiliary piece mounting portion of the semiconductor device in thestate shown in FIG. 8 and a recessed portion of the auxiliary piece.

FIG. 11 is a cross-sectional view of a mold for forming one member ofthe semiconductor device shown in FIG. 1.

FIGS. 12 (a) to 12(c) indicate enlarged cross-sectional views of theessential part shown in FIG. 11.

FIG. 13 (a) is an overall plan view of the semiconductor device, andFIG. 13 (b) is an overall plan view of a case in which a substrate ofthe semiconductor device shown in FIG. 13(a) is incorporated into afull-size semiconductor device.

FIG. 14 is a perspective view of a semiconductor device and theauxiliary piece according to another embodiment of the presentinvention.

FIGS. 15 (a) and 15(b) are perspective views showing an appearances of afront surface-side and a rear surface-side of the semiconductor deviceshown in FIG. 14.

FIG. 16 (a) is a plan view of a front surface-side of the semiconductordevice shown in FIG. 14, FIG. 16 (b) is a side view of the semiconductordevice shown in FIG. 16 (a), FIG. 16 (c) is a back view of thesemiconductor device shown in FIG. 16 (a), and FIG. 16 (d) is a planview of a rear surface-side of the semiconductor device shown in FIG. 16(a).

FIG. 17 (a) is a plan view of front surfaces of the semiconductor deviceand the auxiliary piece shown in FIG. 14,

FIG. 17 (b) is a side view of FIG. 17 (a), and FIG. 17 (c) is a planview of a rear surface of FIG. 17 (a).

FIG. 18 is a plan view of a rear surface-side of a semiconductor deviceaccording to still another embodiment of the present invention.

FIG. 19 is a plan view of a surface of a base substrate of asemiconductor device which inventors of the present invention havestudied.

FIG. 20 is a plan view of a rear surface of abase substrate shown inFIG. 19.

FIG. 21 is a plan view of a surface of a cap for a full-sizesemiconductor device which inventors of the present invention havestudied.

FIG. 22 is a plan view of a rear surface of the cap shown in FIG. 21.

FIG. 23 is a plan view of a rear surface-side of the full-sizesemiconductor device after the base substrate shown in FIG. 19 and FIG.20 is mounted on a groove of the cap shown in FIG. 21 and FIG. 22.

FIG. 24 is a plan view of a front surface of the base substrate whichconstitutes the semiconductor device according to one embodiment of thepresent invention.

FIG. 25 is a plan view of a rear surface of the base substrate shown inFIG. 24.

FIG. 26 is a plan view of a front surface of a cap for a full-sizesemiconductor device which mounts the base substrate shown in FIG. 24and FIG. 25 thereon.

FIG. 27 is a plan view of a rear surface of the cap shown in FIG. 26.

FIG. 28 is a plan view of a rear surface-side of the full-sizesemiconductor device after the base substrate shown in FIG. 24 and FIG.25 is mounted on the cap shown in FIG. 26 and FIG. 27.

FIG. 29 is across-sectional view taken along a line A1-A1 in FIG. 28.

FIG. 30 is an explanatory view of a result of bending rupture strengthtest of the semiconductor device shown in FIG. 23.

FIG. 31 is an explanatory view of a result of bending rupture strengthtest of the semiconductor device shown in FIG. 23.

FIG. 32 is an explanatory view of a result of bending rupture strengthtest of the semiconductor device shown in FIG. 23.

FIG. 33 is an explanatory view of a result of bending rupture strengthtest of the semiconductor device according to one embodiment of thepresent invention.

FIG. 34 is an explanatory view of a result of bending rupture strengthtest of the semiconductor device according to one embodiment of thepresent invention.

FIG. 35 is an explanatory view of a result of bending rupture strengthtest of the semiconductor device according to one embodiment of thepresent invention.

FIG. 36 is a plan view of a rear surface of a cap of the semiconductordevice according to one embodiment of the present invention.

FIG. 37 is an enlarged cross-sectional view of an essential part of thesemiconductor device according to one embodiment of the presentinvention.

FIG. 38 is a cross-sectional view of one example of a mold for moldingthe cap of the semiconductor device shown in FIG. 26 to FIG. 29 and thelike.

FIG. 39 is a plan view of a front surface of the base substrateillustrating an arrangement example of a chip of the semiconductordevice according to one embodiment of the present invention.

FIG. 40 is a plan view of a front surface of the base substrateillustrating an arrangement example of a chip of the semiconductordevice according to one embodiment of the present invention.

FIG. 41 is a flow chart of assembling steps of the semiconductor deviceaccording to one embodiment of the present invention.

FIG. 42 is a plan view of the front surface of the base substrate duringan assembling step of the semiconductor device shown in FIG. 41.

FIG. 43 is a plan view of the front surface of the base substrate duringan assembling step of the semiconductor device succeeding the assemblingstep shown in FIG. 42.

FIG. 44 is a plan view of the front surface of the base substrate duringan assembling step of the semiconductor device succeeding the assemblingstep shown in FIG. 43.

FIG. 45 is a plan view of the front surface of the base substrate duringan assembling step of the semiconductor device succeeding the assemblingstep shown in FIG. 44.

FIG. 46 is a plan view of the front surface of the base substrate duringan assembling step of the semiconductor device succeeding the assemblingstep shown in FIG. 45.

FIG. 47 is a plan view of a rear surface-side of a full-sizesemiconductor device of another embodiment of the present invention.

FIG. 48 is an enlarged plan view of a zone Z1 shown in FIG. 47.

FIG. 49 is a plan view of a rear surface-side of a full-sizesemiconductor device of another embodiment of the present invention.

FIG. 50 is an enlarged plan view of a zone Z2 shown in FIG. 49.

FIG. 51 is a plan view of a rear surface-side of a full-sizesemiconductor device of another embodiment of the present invention.

FIG. 52 is a plan view of a front surface-side of a half-sizesemiconductor device of another embodiment of the present invention.

FIG. 53 is a plan view of a rear surface-side of the semiconductordevice shown in FIG. 52.

FIG. 54 is a plan view of a rear surface-side of a half-sizesemiconductor device of another embodiment of the present invention.

FIG. 55 is a plan view of a rear surface-side of a half-sizesemiconductor device of still another embodiment of the presentinvention.

FIG. 56 is a cross-sectional view of a full-size semiconductor device ofanother embodiment of the present invention.

FIG. 57 is an enlarged cross-sectional view of an essential part in FIG.56.

BEST MODE FOR CARRYING OUT THE INVENTION

In embodiments described hereinafter, when it is necessary for the sakeof convenience, the explanation is made by dividing the invention into aplurality of sections or a plurality of embodiments. However, unlessotherwise specified particularly, these embodiments are not irrelevantto each other and there exists the relationship that one embodiment is amodification, a detailed explanation or a complementary explanation of aportion or the whole of other embodiment.

Further, in the embodiments described hereinafter, when the reference ismade with respect to the number and the like (including number,numerical values, quantity, range and the like) of elements, unlessotherwise specified and unless otherwise the number and the like ofelements are definitely limited to the specific number in principle, thenumber and the like are not limited such specific number and may be anumber above or below the specific number.

Further, in the embodiment described hereinafter, it is needless to saythat the constituent elements (including element steps and the like) arenot always indispensable unless otherwise specified or unless they areconsidered indefinitely indispensable in principle.

In the same manner, in the embodiments described hereinafter, when thereference is made with respect to the shape, the positional relationshipand the like of the constituent elements, unless otherwise specified orunless it is indefinitely considered unreasonable, these shapes andpositional relationship substantially include those which approximate ora similar to these shapes. The same goes for the above-mentionednumerical values and ranges.

Further, in all drawings which are used for explaining the embodimentsof the present invention, the constitutional elements which have thesame functions are given same symbols and the repeated explanationthereof is omitted.

Still further, in the drawings which are used for this embodiment,hatching may be provided also to the plan view for facilitating theunderstanding of the drawing.

Hereinafter, the preferred embodiments of the present invention aredescribed in detail in conjunction with attached drawings.

Embodiment 1

FIG. 1 is a perspective view of a semiconductor device and an auxiliarypiece which constitute one embodiment of the present invention, FIG. 2(a) and FIG. 2(b) are perspective views showing an appearance of a frontsurface-side and an appearance of a rear surface-side of thesemiconductor device shown in FIG. 1, FIG. 3 (a) is a plan view of afront surface-side of the semiconductor device shown in FIG. 1, FIG. 3(b) is a side view of the semiconductor device shown in FIG. 3 (a), FIG.3 (c) is a back view of the semiconductor device shown in FIG. 3(a),FIG. 3 (d) is a plan view of a rear surface-side of the semiconductordevice shown in FIG. 3 (a), FIG. 4 (a) is an enlarged cross-sectionalview of an essential part of an auxiliary piece mounting portion in thelongitudinal direction of the semiconductor device shown in FIG. 1, FIG.4 (b) is an enlarged cross-sectional view of an essential part of theauxiliary piece mounting portion in the lateral direction of thesemiconductor device shown in FIG. 1, FIG. 5 (a) is a cross-sectionalview taken along the lateral direction (line A-A) of the semiconductordevice shown in FIG. 3(a), FIG. 5 (b) is an enlarged cross-sectionalview of an essential part of FIG. 5 (a), and FIG. 6 is a plan view of abase substrate of the semiconductor device.

The semiconductor device according to this embodiment is a memory card 1which can be used as an auxiliary storage device of an electronic devicesuch as information equipment, communication equipment or the like, forexample. This memory card 1 is formed of a small thin plate having aplanar rectangular shape, for example. With respect to dimensions of theprofile, a length of long sides is set to approximately 24 mm, a lengthof short sides is set to approximately 18 mm and a thickness is set toapproximately 1.4 mm, for example. Provided that these dimensions of theprofile are maintained, the memory card 1 can be used for a miniaturizedelectronic device such as a portable telephone set, a digital camera orthe like, for example. However, by mounting a metal-made adapter(auxiliary piece) 2 on the memory card 1, the memory card is configuredto be used for a relatively large-sized electronic device such as aportable personal computer or the like. Here, the memory card which canbe directly used for the above-mentioned large-sized electronic deviceis named as a full-size memory card and the memory card 1 of thisembodiment which can be used for the above-mentioned miniaturizedelectronic device is also named as a half-size memory card.

A cap (case body) 3 which defines the profile of the memory card 1 isformed of resin having insulation property such as ABS resin or PPE(Poly Phenylen Ether) from a viewpoint of making the cap 3light-weighted, facilitating machining of the cap and impartingflexibility. The cap 3 is applied to a base substrate 4 such that thecap 3 covers a part mounting surface side on which semiconductor chips(hereinafter simply referred to as “chips”) 5 a, 5 a, 5 b are mounted.With respect to the cap 3, on two portions arranged at both cornerportions of a rear surface side of the memory card 1, adapter mountingportions 3 a having a projecting cross section are formed. These adaptermounting portions 3 a are portions on which recessed portions 2 a of theadapter 2 are fitted. These adapter mounting portions 3 a are formed byindenting a front surface, a side surface and a rear surface of the cap3 by an amount corresponding to a plate thickness of the adapter 2compared to the front surface, the side surface and the rear surface ofportions of the cap 3 other than the adapter mounting portion 3 a. Thatis, the adapter mounting portion 3 a is formed such that a thicknessthereof is slightly smaller than a thickness of the memory card 1.

According to this embodiment, by providing the projecting cross sectionto the adapter mounting portions 3 a formed on the cap 3 of the memorycard 1, compared to a case in which the adapter mounting portions 3 aare formed in a recessed shape, the mechanical strength of the adaptermounting portion 3 a can be increased twice or more.

When the adapter mounting portions 3 a have a recessed cross section, itis necessary to provide two projecting portions in the thicknessdirection of the memory card 1. However, since there exists an upperlimit with respect to the thickness of the memory card 1 and hence, itis difficult for respective projecting portions to ensure the sufficientthickness. The cap 3 is constituted of resin from the viewpoint ofmaking the cap 3 light-weighted, facilitating machining of the cap 3 andimparting flexibility to the cap. Accordingly, when the thickness ofrespective projecting portions at the recessed portion which constitutethe adapter mounting portion is excessively thin, it is difficult toensure the mechanical strength. On the other hand, when the thickness ofrespective projecting portions at the recessed portion is excessivelyincreased, the formation of the recessed portion per se becomesdifficult. On the contrary, as in the case of this embodiment, when theadapter mounting portion 3 a has the projecting cross section, it issufficient to provide only one adapter mounting portion 3 in thethickness direction of the memory card 1. That is, respective projectingportions which are formed by forming the adapter mounting portion 3 inthe recessed shape are collected at one portion so that the projectingportion having relatively thick wall can be formed. Here, one half(d1/2) of the thickness of the adapter mounting portion 3 a having theprojecting cross section can be increased to a value substantially equalto the thickness d2 of the indentation. That is, it is possible toobtain the relationship Max (d1/2)=d2 (see FIG. 3 (a) to FIG. 3 (c),FIG. 4 (a)). Accordingly, it is possible to make the adapter mountingportion 3 a have a relatively large thickness and hence, even when theadapter mounting portion 3 a is constituted of a portion of theresin-made cap 3, the adapter mounting portion 3 a can ensure themechanical strength. Further, since the adapter mounting portion 3 a hasthe projecting cross section, the adapter mounting portion 3 a can beeasily formed. Further, to consider a case in which the adapter 2 andthe cap 3 are formed of the same resin, it is possible to reduce thethickness of the adapter mounting portions 3 a to a level whichsatisfies the relationship d1=d/3 while ensuring the mechanical strengthwhich is obtained when the relationship d1=d2 is established.

Further, in this embodiment, since the adapter mounting portions 3 a areformed at two portions arranged at both corner portions of the rearsurface side of the memory card 1, the adapters 2 are snuggly fittedinto both longitudinal end portions of the rear surface side of thememory card 1 so that it is possible to enhance the stability when theadapter 2 is mounted on the memory card 1.

Further, in this embodiment, with respect to the cap 3, the portionwhich is sandwiched by the adapter mounting portions 3 a, 3 a arrangedat the above-mentioned both corner portions, that is, the longitudinallycenter portion of the rear surface side of the memory card 1 is formedto have substantially the same thickness as the thickness of the memorycard 1 and is set greater than the thickness of the adapter mountingportion 3 a. Due to such a constitution, compared to a case in which therear surface side of the memory card 1 is totally made thin along thelongitudinal direction of the memory card 1, the mechanical strength atcontacting portions between the cap 3 and the adapter 2 can be enhanced.

Further, in this embodiment, since the adapter mounting portions 3 ahave the projecting cross section, it is possible to sufficiently ensurethe length of the adapter mounting portion 3 a (lateral length of thememory card 1) L1, that is, the length in the direction to make therecessed portion 2 a of the adapters 2 fitted into the adapter mountingportions 3 a as well as the length along which the recessed portions 2 aoverlap the adapter mounting portions 3 a. When the adapter mountingportions 3 a have the recessed cross section, as described above, toconsider the assurance of the strength of the respective projectingportions at the recessed portion, it is difficult to sufficientlyincrease the length L1. On the contrary, in this embodiment, it ispossible to ensure the thickness of the adapter mounting portions 3 aand hence, it is possible to ensure the mechanical strength of theadapter mounting portions 3 a. Accordingly, the length L1 can beelongated to some extent. Here, the length L1 is set greater than thethickness d1 of the adapter mounting portion 2 a. That is, it ispossible to establish the relationship L1>d1. In this manner, byelongating the length L1 of the adapter mounting portions 3 a, theadapter mounting portions 3 a of the memory card 1 can be firmlysuppressed by the recessed portion 2 a of the adapter 2 so that therigidity of a connecting portion between the memory card 1 and theadapter 2 can be ensured. Accordingly, a drawback that the connectingportion between the memory card 1 and the adapter 2 breaks due tobending or the like can be reduced or prevented.

Further, in this embodiment, the state of the adapter mounting portions3 a is made asymmetric with respect to the front surface-side and therear surface-side of the memory card 1. To be more specific, the widthsW1, W2 of the adapter mounting portions 3 a (longitudinal length of thememory card 1) are made asymmetric and the dimensions of respectivewidths W1, W2 are different from each other (see FIG. 3). Here, thewidth W1 of the front surface side is set wider than the width W2 of therear surface side, for example. This provision is made to prevent theerror in mounting direction of the adapter 2. That is, since thedimensions of the widths W1, W2 of the adapter mounting portions 3 a aredifferent from each other, when the mounting direction of the adapter 2is in error, the adapter 2 cannot be mounted. Accordingly, it ispossible to prevent the occurrence of damage or rupture on the memorycard 1 derived from the erroneous mounting of the adapter 2. Further, itis unnecessary for a user to particularly pay an attention to thecorrect or erroneous mounting direction of the memory card 1 and hence,the user can mount the adapter 2 on the memory card 1 in a relaxed modeand this enables the stable handling of the memory card 1 with respectto the card mounting equipment.

Further, in this embodiment, in the vicinity of the back-face side ofthe rear surface-side of the memory card 1, at the longitudinal centerof the memory card 1, an adapter pawl mounting portion 3 b is formed.The adapter pawl mounting portion 3 b is a portion which catches a pawlportion 2 b of the adapter 2 and is constituted of an indented portion 3b 1 and a groove portion 3 b 2. The indented portion 3 b 1 is formedsuch that the rear surface of the cap 3 is indented by an amount ofplate thickness of the adapter 2 extending over from the back face ofthe memory card 1 to the groove portion 3 b 2. Further, the grooveportion 3 b 2 is formed of an indentation whose depth is deeper than adepth of an indentation of the indented portion 2 b 1. By allowing theentrance of the pawl portion 2 b of the adapter 2 into the inside of thegroove portion 3 b 2, the memory card 1 and the adapter 2 are firmlyconnected and fixed to each other.

Further, in the vicinity of the back-face of the front surface of thememory card 1, at the longitudinal center of the memory card 1, a cardremoving groove 3 c is formed. This card removing groove 3 c facilitatesthe removal of the memory card 1 when the memory card 1 is removed fromthe above-mentioned electronic device. That is, by pulling a fingerparallel to the front surface of the cap 2 in a state that the fingertouches the card removing groove 3 c, it is possible to pull out thememory card 1 from the above-mentioned electronic device. A depth d2 ofthe groove portion 3 b 2 formed in the rear surface-side of theabove-mentioned memory card 1 is set greater than a depth d3 of the cardremoving groove 2 c formed in the front surface-side of the memory card1 (see FIG. 5(b)).

Here, from a viewpoint of enhancement of recognition of the mountingdirection of the memory card 1, a corner of the frontal-face side of thememory card 1 is notched. Further, on the front surface of the cap 3 ofthe memory card 1, in the vicinity of the frontal face of the memorycard 1, a mark 3 d having a planar triangular shape which indicates theinsertion direction at the time of inserting the memory card 1 into theabove-mentioned electronic device is formed.

Two chips 5 a, 5 a mounted on the base substrate 4 of theabove-mentioned memory card 1 have the same profile dimensions and flashmemories (EEPROM) having the same storage capacity are formed in thechips 5 a, 5 a. These chips 5 a, 5 a are mounted on the base substrate 4such that the other chip 5 a is superposed on one chip 5 a. The chip 5 aconstituting a lower layer is bonded to an upper surface of the basesubstrate 4 by an adhesive agent or the like, while the chip 5 aconstituting an upper layer is bonded to an upper surface of the chip 5a constituting the lower layer by an adhesive agent or the like. On theother hand, a chip 5 b for controller is mounted on the base substrate 4in the vicinity of the chips 5 a for memory and is bonded to the uppersurface of the base substrate 4 by an adhesive agent or the like. All ofthree chips 5 a, 5 a, 5 b are mounted on the base substrate 4 in a statethat main surfaces (die forming surfaces) thereof are directed upwardly.

On respective main surfaces of two chips 5 a, 5 a in which flashmemories (EEPROM) are formed, a plurality of bonding pads are formed asan array along one sides thereof. That is, the chip 5 a for memoryadopts a one side pad method in which bonding pads are formed on aperipheral portion of a die forming surface and these bonding pads arearranged in an array along one side of the peripheral portion. On theother hand, on the main surface of the chip 5 b for controller, aplurality of bonding pads are formed in an array along two longitudinalsides which face each other, for example.

Two chips 5 a, 5 a are superposed each other in a state that they aredirected in the same direction, wherein the bonding pads of one chip 5 aand the bonding pads of the other chip 5 a are arranged close to eachother. Further, the chip 5 a constituting the upper layer has a portionthereof arranged in a state that the portion is displaced in thedirection (direction X) parallel to one side of the chip 5 aconstituting the lower layer and in the direction (direction Y)perpendicular to the direction X.

On the base substrate 4 in the vicinity of the above-mentioned chips 5a, 5 b, a plurality of electrodes are formed. The bonding pads ofrespective chips 5 a, 5 a, 5 b are electrically connected tocorresponding electrodes through bonding wires 6 made of gold (Au) orthe like. The bonding pads on the chip 5 a are electrically connected toconnection terminals 7 formed on one end of one main surface of the basesubstrate 4 and test pads 8 formed on the other end of the main surfaceof the base substrate 4 through the above-mentioned electrodes and lineson the base substrate 4 which are electrically connected to theelectrodes. The connection terminals 7 are used as connection terminalswhen the memory card 1 is mounted in the above-mentioned electronicdevice and are electrically connected to external connection terminals 9formed on a rear surface of the base substrate 4 via through holes 10.Further, test pads 8 are used for measuring electric characteristics inassembling steps of the memory card 1 or the like. The chips 5 a, 5 b,the bonding wires 6 and most of the part mounting surface of the basesubstrate 4 (excluding the connection terminals 7, the test pads 8 andperipheries of regions where these connection terminals 7 and test pads8 are arranged) are covered with sealing resin 11 made of epoxy-basedresin or the like, for example.

Subsequently, the above-mentioned adapter 2 is explained. FIG. 7 (a) isa plan view of a front surface side of the adapter 2, FIG. 7 (b) is aside view of the adapter 2 shown in FIG. 7 (a), FIG. 7 (c) is a frontview of the adapter 2 shown in FIG. 7 (a), FIG. 7 (d) is a plan view ofa rear surface side of the adapter 2 shown in FIG. 7 (a), and FIG. 7 (e)is an enlarged cross-sectional view of an essential part of a pawlportion 2 b and a support portion 2 c of the adapter 2 shown in FIG. 7(a).

Although the adapter 2 may be formed of resin material, the adapter 2 isformed of a metal plate having rigidity higher than that of resinmaterial, for example, stainless steel, titanium (Ti), iron (Fe) oralloy containing iron. When stainless steel is selected as the materialof the adapter 2, since stainless steel exhibits high corrosionresistance, it is unnecessary to apply surface treatment such as platingon a surface thereof. Accordingly, the formation of the adapter 2 isfacilitated. Further, the manufacturing cost can be reduced. On theother hand, when iron or the like is selected as the material of theadapter 2, the corrosion resistance can be enhanced by applying platingtreatment on a surface thereof.

Recessed portions 2 a of the adapter 2 are formed by bending bothlongitudinal ends of the adapter 2 such that the recessed portions 2 ahave an approximately U-shaped cross section. Accordingly, the adapter 2has a region which is vacant to some extent in the thickness directionthereof. The adapter 2 may be formed in a hollow shape.

In this manner, according to this embodiment, the adapter 2 is formed bybending a sheet of metal plate and by forming grooves 2 d and a hole 2 ein the metal plate. That is, this embodiment does not use metal cuttingtechnique or the like which requires precision machining. Further, thenumber of parts is small. Accordingly, it is possible to reduce themanufacturing cost of the adapter 2.

In the adapter 2, the above-mentioned two grooves 2 d are formed in astrip shape, wherein the grooves 2 d extend from a frontal face of theadapter 2 in parallel in the lateral direction of the adapter 2 (upwardand downward direction in FIG. 7 (a), (d)) until the grooves 2 d reach aplanar position in the midst of the lateral direction. Theabove-mentioned support portion 2 c is formed on a portion sandwiched bythese two grooves 2 d in plane (longitudinal center of the adapter 2). Astarting end of the support portion 2 c is integrally connected to theadapter 2. The other end of the support portion 2 c is integrally formedwith the above-mentioned pawl portion 2 a. The support portion 2 c has afunction of a leaf spring (resilient body). The support portion 2 c isformed in a rectangular shape in plane and is formed such that thesupport portion 2 c is gradually bent from the front surface to the rearsurface of the adapter 2 in cross section. That is, the support portion2 c is formed with flexibility. In this manner, by providing theflexibility to the support portion 2 c, the resiliency is enhanced and,at the same time, the durability of the support portion 2 c as theresilient body can be enhanced. In this manner, it is preferable thatthe length of the support portion 2 c is designed to a length which canimpart a proper resiliency to the support portion 2 c.

Further, the hole 2 e is formed in the vicinity of the back-face side ofthe adapter 2. There may be a case that when the memory card 1 ismounted in the electronic device in a state that the adapter 2 ismounted on the memory card 1 and, thereafter, the memory card 1 is to beremoved from the electronic device, it is difficult to remove the memorycard 1 from the electronic device. In such a case, it is preferable totake out the memory card 1 by engaging a pawl or a tool with this hole 2e. The hole 2 e may be formed in a squeezed shape such as a groove inplace of a hole.

FIGS. 8(a) to 8(c) show a state in which the above-mentioned adapter 2is mounted in the above-mentioned memory card 1. FIG. 8(a) is a planview of the front surfaces of the memory card 1 and the adapter 2, FIG.8 (b) is a side view of FIG. 8 (a), and FIG. 8 (c) is a plan view ofrear surfaces of FIG. 8 (a). Further, FIG. 9(a) to 9(c) show theabove-mentioned full-size memory card 50 for comparison. FIG. 9 (a) is aplan view of a front surface of the memory card 50, FIG. 9 (b) is a sideview thereof, FIG. 9 (c) is a plan view of a rear surface thereof.Further, FIG. 10 (a) shows a cross section of a connecting portion ofthe adapter pawl mounting portion 3 b of the memory card 1 and the pawlportion 2 b of the adapter 2, and FIG. 10 (b) shows a cross section ofthe connecting portion of the adapter mounting portion 3 a of the memorycard 1 and the recessed portion 2 a of the adapter 2.

The adapter 2 is mounted on the memory card 1 in the state that theadapter mounting portion 3 a of the memory card 1 is fitted into theinside of the recessed portion 2 a and the pawl portion 2 b formed onthe distal end of the support portion 2 c of adapter 2 is fitted intothe inside of the groove portion 3 b 2 of the adapter pawl mountingportion 3 b of the memory card 1. Particularly, the support portion 2 cof the adapter 2 is mounted in the memory card 1 in the state that thesupport portion 2 c enters a rear surface side from the front surfaceside of the memory card 1. By mounting the adapter 2 on the memory card1, the memory card 1 has the dimensions (32 mm×24 mm×1.4 mm, forexample) which are equivalent to the dimensions of full-size memory card50. Accordingly, the half-size memory card 1 which is available for theabove-mentioned miniaturized electronic device is also available for theabove-mentioned large-sized electronic device for the full-size memorycard 50. That is, it is possible to enhance the versatility of thehalf-size memory card 1.

The pawl portion 2 b of the adapter 2 is firmly fitted into the insideof the groove portion 3 b 2 of the adapter pawl mounting potion 3 a ofthe memory card 1 in the state that the pawl portion 2 b has resiliencyin the upward direction shown in FIG. 10(a), that is, in the directionwhich faces the cap 3. Due to such a constitution, it is possible tosurely connect the memory card 1 to the adapter 2. Further, the adaptermounting portion 3 a of the memory card 1 is fitted in the recessedportion 2 a of the adapter 2. Due to such a constitution, it is possibleto connect the memory card 1 and the adapter 2 in a stable manner.

To remove the adapter 2 from the memory card 1, the support portion 2 cof the adapter 2 may be pushed downwardly in the direction of the rearsurface from the front surface side of the adapter 2 so as to disengagethe pawl portion 2 b formed on the distal end of the support portion 2 cfrom the adapter pawl mounting portion 3 b of the memory card 1.Accordingly, the adapter 2 can be easily removed with a single hand sothat the removing operation can be performed extremely easily. For thisend, it is preferable that the length of the support portion 2 cobserved from the front surface of the memory card 1 at the time ofmounting is of a size which allows the insertion of a finger of aperson. Here, since the support portion 2 c has the resiliency asmentioned above, the support portion 2 c returns to the original shapewhen the adapter 2 is removed.

Subsequently, one example of a mold served for forming the cap 3 of thememory card 1 is explained. FIG. 11 is a cross-sectional view of a mold15 and shows a cross section at the same portion as FIG. 5. Further,FIGS. 12 (a) to 12(c) are enlarged cross-sectional views of an essentialpart shown in FIG. 11, wherein FIG. 12 (a) is a cross-sectional view ofthe same portion as FIG. 5 (b) at a back-face side of the cap 3, FIG. 12(b) is a cross-sectional view of a portion corresponding to the adaptermounting portion 3 a at the back-face side of the cap 3, and FIG. 12 (c)is a cross-sectional view of the same portion as FIG. 5 at a frontalface side of the cap 3.

At a portion where a lower mold 15 a and an upper mold 15 b aresuperposed each other, a cavity 15 c for molding the cap 3 is defined.In this embodiment, angles α1 to α11 and the like of corner portions ofthe mold 15 (lower mold 15 a and upper mold 15 b) which face the cavity15 c are set to 90° or more (see FIG. 12). Due to such a constitution,the cap 3 can be easily molded. Assuming that the above mentioned anglesα1 to α11 and the like are set to a value below 90°, it is difficult topeel off the cap 3 from the mold 15 after molding the cap 3 and hence,it is necessary to form the cap 3 piece by piece or to provide aparticular mold structure. In this case, the manufacturing cost ispushed up. On the contrary, according to this embodiment, by setting theangles α1 to α11 and the like to 90°, there arises no such drawback andthe caps 3 can be manufactured on a mass production basis. Further, noparticular mold structure is necessary. Accordingly, the manufacturingcost of the memory card 1 can be reduced. Angles of corner portions ofthe front surface, the side surfaces and the rear surface of the cap 3molded using such a mold 15 are set to 90° or more.

Further, in this embodiment, a depth (approximately thickness d5+d6) ofthe cavity 15 c at the lower mold 15 a side for forming the innersurface of the cap 3 is set larger than a depth (approximately equal tothickness d7) of the cavity 15 c at the upper mold 15 b side for formingthe outer front surface of the cap 3. Then, at a portion correspondingto the thickness d6, a gate for filling resin which has a most portionthereof arranged at the lower mold 15 a side is formed. The reason thatthe depth of the cavity 15 c at the lower mold 15 a side is larger thanthe depth of the cavity 15 c at the upper mold 15 b side is that thenumber of irregularities or steps formed on the inner side (bottomsurface side) of the cavity 15 c at the lower mold 15 a side is largerthan those of the upper mold 15 b and hence, when a certain amount ofresin is not ensured, it is difficult smoothly fill the cavity 15 c withthe resin. Further, with respect to the thicknesses d5 to d7, thethickness d6 exhibits the largest dimension. This setting is made toimprove the ability of resin to be filled into the inside of the cavity15 c from the gate. That is, when the thickness d6 is excessively thin,it is difficult to allow the resin to flow into the inside of the cavity15 c through the gate. Here, the thickness d5 is set to approximately0.5 mm, for example. The thickness d6 is set to approximately 0.6 mm,for example. The thickness d7 is set to approximately 0.3 mm, forexample.

In this embodiment, the above-mentioned memory card 1 is manufacturedsuch that the cap 3 is molded by filling the resin in the inside of thecavity of the mold 15 and, thereafter the cap 3 is applied onto the basesubstrate 4 such that the cap 3 covers the part mounting surface of thebase substrate 4 on which the chips 5 a, 5 b are mounted.

Subsequently, one example of an assembling method of the semiconductordevice according to this embodiment is explained. FIGS. 13(a) and 13(b)are views for explaining such an assembling method, wherein FIG. 13 (a)is an overall plan view of the memory card 1 and FIG. 13 (b) is anoverall plan view when the base substrate 4 of the memory card 1 is usedin a state that the base substrate 4 is incorporated into the full-sizememory card. A net-like hatching portion indicates a plane of the basesubstrate 4.

In this embodiment, the base substrate 4 (the base substrate 4 in thestate that chips 5 a and the like are mounted thereon) which is used forassembling the half-size memory card 1 is directly used as a full-sizememory card 1A. That is, portions of the memory cards 1, 1A which differin a planar size are shared in common.

Since the most of the manufacturing cost of the memory card is occupiedby the manufacturing cost of the base substrate 4, the reduction of themanufacturing cost of the base substrate 4 is effective to reduce themanufacturing cost of the memory card 1. However, when the basesubstrates 4 are separately manufactured with respect to the half-sizememory card 1 and full-size memory card 1A, these base substrates 4require separate manufacturing steps, separate manufacturing devices andseparate personnel and the like respectively. This incurs the increaseof the manufacturing cost of the base substrates 4 so that themanufacturing cost of the memory card is increased. On the contrary, byusing the base substrate 4 in common between the memory cards 1, 1A, itis unnecessary to separately provide the manufacturing steps,manufacturing devices or personnel with respect to the half-size memorycard 1 and the full size memory card 1A so that it is possible tolargely reduce the manufacturing cost of the memory cards 1, 1A.

When such an assembling method is adopted as shown in FIG. 13 (b), thebase substrate 4 having a planar area which is equal to or less than onehalf of a planar area of the cap 16 is mounted on the full-size memorycard 1A.

Embodiment 2

FIG. 14 is a perspective view of a semiconductor device and an auxiliarypiece of another embodiment of the present invention, FIGS. 15 (a) and15 (b) are perspective views showing appearances of a front surface sideand rear surface side of the semiconductor device shown in FIG. 14, FIG.16 (a) is a plan view of the front surface side of the semiconductordevice shown in FIG. 14, FIG. 16 (b) is a side view of the semiconductordevice shown in FIG. 16 (a), FIG. 16 (c) is a back view of thesemiconductor device shown in FIG. 16 (a), FIG. 16(d) is a plan view ofthe rear surface side of the semiconductor device shown in FIG. 16(a),FIG. 17 (a) is a plan view of the front surfaces of the semiconductordevice and auxiliary piece shown in FIG. 14, FIG. 17 (b) is a side viewof FIG. 17 (a), and FIG. 17 (c) is a plan view of the rear surface ofFIG. 17(a).

This embodiment is equal to the above-mentioned embodiment 1 except forthat the shape of connecting portions between the memory card 1 and theadapter 2 differs from that of the above-mentioned embodiment 1. Thatis, side faces of the adapter mounting portions 3 a of the memory card 1are formed coplanar with side faces of the memory card 1. That is, theside face portions of the adapter mounting portions 3 a are notindented. Further, at portions of the recessed portions 2 a of theadapter 2 which are fitted into these adapter mounting portions 3 a,grooves 2 a 1 which allow the side face portions of the above-mentionedadapter mounting portions 3 a to enter also to the side faces of thememory card 1 are partially formed.

Also in this case, as shown in FIG. 17, it is possible to mount theadapter 2 on the memory card 1 in a neatly arranged state withoutgenerating irregularities or drawbacks at the connecting side faces ofthe memory card 1 and the adapter 2.

This embodiment having such a constitution can also obtain advantageouseffects similar to those of the above-mentioned embodiment 1.

Embodiment 3

FIG. 18 is a plan view of a rear surface side of a semiconductor deviceof still another embodiment of the present invention. In thisembodiment, in the vicinity of the adapter mounting portions 3 a at aback-face side of the memory card 1, a plurality of connection terminals17 are regularly arranged in parallel along the longitudinal directionof the memory card 1. The connection terminals 17 are formed on the rearsurface side of a base substrate 4 and are electrically connected with amemory circuit formed on the base substrate 4 through wiring on the basesubstrate 4. These connection terminals 17 constitute terminals fortesting the above-mentioned memory circuit or for adding functions.

Embodiment 4

First of all, a drawback that inventors of the present invention haveoriginally found out in a technique which the inventors have studied isexplained in conjunction with FIG. 19 to FIG. 23.

FIG. 19 and FIG. 20 respectively show plan views of a front surface(part mounting surface) and a rear surface (external connection terminalforming surface) of the above-mentioned base substrate 4. The basesubstrate 4 is formed in a rectangular shape in plane and a chamferedportion (third chamfered portion) 4 a which eliminates a corner isformed on one corresponding corner portion. The chamfered portion 4 a isformed to conform with a chamfered portion for indexing which is formedat a distal end of a front face (mounting end) of the memory card.

FIG. 21 and FIG. 22 are respectively plan views of a front surface and arear surface of a cap (a first case body) 16 for the above-mentionedfull-size memory card which the inventors have studied. The cap 16 isformed of resin or the like similar to that of the above-mentionedhalf-size cap 3. In the cap 16, at one front-face side corner portion ofthe memory card, a chamfered portion (second chamfered portion) 16 a forthe above-mentioned indexing is formed. This chamfered portion 16 a isprovided from a viewpoint of facilitating the recognition of themounting direction of the full-size memory card.

Further, a groove 16 b is formed in the rear surface of the cap 16 atthe front face side of the memory card. This groove 16 b is provided formounting the base substrate 4 on the cap 16 and is formed such that thegroove 16 b occupies a region extending from the vicinity of the distalend of the cap 16 to a position slightly ahead of a longitudinally halfposition of the cap 16. The planar shape and dimensions of the groove 16b are formed such that the planar shape is equal to the planar shape ofthe base substrate 4 and the planar dimensions are slightly larger thanthe planar dimensions of the base substrate 4 so as to facilitate theaccommodation and fitting of the base substrate 4. Accordingly, in thegroove 16 b, one corner portion thereof at the front face side of thecap is chamfered along the chamfered portion 16 a of the cap 16 thusforming a chamfered portion 16 b 1. Further, among two long sides of thegroove 16 b, the long side which is formed at the longitudinally centerside of the cap 16 crosses two short sides of the groove 16 b at a rightangle. Further, within a region of the groove 16 b, at an outerperiphery, a stepped portion 16 e which has a thickness slightly largerthan a thickness of the inner side of the groove 16 b and is slightlysmaller than a thickness of the outside of the groove 16 b is formed. Aplurality of pin traces 16 f which are formed by cutting the steppedportion 16 e indicate traces where ejector pins come into contact withwhen the cap 16 is removed from a mold after molding the cap 16 usingthe mold.

Further, on the front surface and the back surface of the cap 16, in thevicinity of the back side, card removing grooves 16 c 1, 16 c 2 areformed. These card removing grooves 16 c 1, 16 c 2 are grooves whichperform functions similar to the functions of card removing grooves 3 cwhich have been explained in the previous embodiment 1 (See FIG. 1 andthe like). A depth of the rear-surface side groove portion 16 c 2 is setgreater than a depth of the front-surface side card removing groove 16 c1. It may be possible to provide only either one of these card removinggrooves 16 c 1, 16 c 2. Further, on the surface of the cap 16, in thevicinity of the frontal face, a planar triangular mark 16 d whichindicates the insertion direction when the full-size memory card ismounted in the electronic device is formed. Further, on the most portionof the front surface of the cap 16, a rectangular shallow indentation 16g having round corners in plane is formed. This indentation 16 g isprovided for laminating a seal or the like on which various informationare written in such a manner that the classification of the memory cardsis written or the like.

FIG. 23 is a plan view of the rear surface-side of the full-size memorycard 1A after the base substrate 4 shown in FIG. 19 and FIG. 20 ismounted in the groove 16 b of the cap 16 shown in FIGS. 21 and 22. Thebase substrate 4 is neatly mounted on the region which substantiallycovers one longitudinal half of the cap 16.

Here, the inventors have carried out the bending rupture strength testwith respect to the full-size memory card 1A shown in FIG. 23. Thebending rupture strength test is performed as follows, for example. Firsto fall, the memory card 1A is mounted on a test base in a state thatthe rear surface-side of the memory card 1A faces an upper surface ofthe test base. Here, support members are interposed between the rearsurface-side of the memory card 1A and the upper surface of the testbase at two positions in the vicinity of both longitudinal ends of thememory card 1A such that a gap of a given dimension is formed betweenthe rear surface of the memory card 1A and the upper surface of the testbase. In this state, by applying a load of a given quantity to thelongitudinal center on the front surface of the memory card 1A so as tobend the memory card 1A, the rupture strength of the memory card 1A isevaluated.

As a result of this experiment, the inventors have originally found outthat the memory card 1A shown in FIG. 23 suffers from followingdrawbacks. That is, the memory card 1A shown in FIG. 23 exhibits thelower bending rupture strength compared to the structure of a full-sizememory card having a base substrate and a cap whose planar dimensionsare approximately equal to those of the memory card 1A and hence, thebase substrate 4 is peeled off at a boundary portion (gap portion)between the cap 16 and the base substrate 4 at the center of the rearsurface-side of the memory card 1A, or cracks are generated on the cap16 with portions where a long side which is formed at the longitudinallycenter side of the cap 16 out of long sides of the groove 16 b formed inthe cap 16 crosses two short sides of the groove 16 b at right anglebeing as a starting point.

Accordingly, in this embodiment, in the full-size memory card in whichthe planar dimension of the base substrate occupies approximately onehalf of the planar dimension of the cap, the structure which can enhancethe above-mentioned bending rupture strength is proposed. To be morespecific, the structure has a following constitution.

FIG. 24 and FIG. 25 are respectively plan views of a front surface (partmounting surface) and a rear surface (external connection terminalforming surface) of the base substrate 4 of the embodiment 4. In thebase substrate 4 of this embodiment 4, besides the above-mentionedchamfered portion 4 a, corners at two corner corresponding portions areeliminated thus forming chamfered portions (first chamfered portions) 4b, 4 c. These chamfered portions 4 b, 4 c exhibit a chamfered amountsmaller than that of the chamfered portion 4 a and are formed such thatthey have the same size and shape to form a left-and-right symmetry.Except for these constitutions, the base substrate 4 of this embodiment4 has the same constitutions as those explained in conjunction with theabove-mentioned embodiment 1, FIG. 19 and FIG. 20 and the like.

FIG. 26 and FIG. 27 are respectively plan views of a front surface andrear surface (base substrate mounting surface) of a cap 16 for afull-size memory card which mounts the base substrate 4 shown in FIG. 24and FIG. 25 thereon. The cap 16 of this embodiment 4 differs in theshape of a groove (first groove) 16 b which mounts the base substrate 4therein from the previously-mentioned cap 16. Except for the aboveconstitution, the cap 16 of this embodiment 4 has the same constitutionas that of the cap 16 explained in conjunction with the above-mentionedembodiment 1, FIG. 21 and FIG. 22. That is, in this embodiment 4, withrespect to the planar shape and dimensions of the groove 16 b, to enablethe neat fitting of the base substrate 4 shown in FIG. 24 and FIG. 25into the groove 16 b, the groove 16 b has the same planar shape as thebase substrate 4 and has the planar dimensions which are slightly largerthan those of the base substrate 4. Accordingly, with respect to longsides of the groove 16 b, the long side 16 b 2 which is formed at thelongitudinally center side of the cap 16 does not cross two short sides16 b 3, 16 b 3 of the groove 16 b at a right angle and the portionswhere the long sides 16 b 2 and the short sides 16 b 3 originally crosseach other have corners thereof eliminated so that chamfered portions(first chamfered portions) 16 b 4, 16 b 5 are formed. That is, thegroove 16 b is configured such that portions between the long side 16 b2 and the short sides 16 b 3 gradually change crossing angles by way ofthe chamfered portions 16 b 4, 16 b 5 which intercect the long sizes 16b 2 and the short sides 16 b 3 obliquely. Alternatively, the groove 16 bis configured such that at two corner portions which are originallyformed at the longitudinally center side of the cap 16, reinforcingportions 16 h 1, 16 h 2 having a right-angled isosceles triangular shapeare arranged in a state that right-angular portions are aligned with twocorner portions. These chamfered portions 16 b 4, 16 b 5 exhibit achamfered amount smaller than that of the chamfered portion 16 a andhave the same size and shape to form a right-and-left symmetry eachother.

FIG. 28 is a plan view of the rear surface-side of the full-size memorycard 1A after the base substrate 4 shown in FIG. 24 and FIG. 25 ismounted on the cap 16 shown in FIG. 26 and FIG. 27, and FIG. 29indicates a cross-sectional view taken along a line A1-A1 in FIG. 28. Inthis embodiment 4, the base substrate 4 is mounted in the inside of thegroove 16 b such that the front surface of the base substrate 4 isdirected to the groove 16 b side formed on the rear surface of the cap16 and the chamfered portions 4 b, 4 c of the base substrate 4respectively face the chamfered portions 16 b 4, 16 b 5 of the groove 16b. The base substrate 4 is supported in a state that the outerperipheral portion of the front surface thereof is brought into contactwith the stepped portion 16 e in the inside of the groove 16 b of thecap 16.

In this embodiment 4, the length of contact between the base substrate 4and the groove 16 b can be set longer than the length of contact in thecase illustrated in FIG. 23 and hence, the connecting strength betweenthe base substrate 4 and the cap 16 can be enhanced. Further, since theright-angled portions which are liable to be subjected to stressconcentration can be eliminated by providing the chamfered portions 4 b,4 c to the base substrate 4 and by providing the chamfered portions 16 b4, 16 b 5 to the groove 16 b, it is possible to disperse the stress.Accordingly, in performing the bending rupture strength test, it ispossible to prevent or suppress the peeling off of the base substrate 4and it is also possible to suppress or prevent the occurrence of crackson the cap 16.

Further, the above-mentioned structure which can enhance the bendingrupture strength requires no additional other new members and is asimple structure obtained by only chamfering the corner portions of thebase substrate 4 and the corner portions of the groove 16 b of the cap16 whereby the structure can be formed easily. Accordingly, theproductivity is not damaged so that this embodiment can provide thehighly reliable full-size memory card 1A.

It has been found that the full-size memory card 1A of this embodiment 4is an effective structure also in an electrostatic rupture test. In thiselectrostatic rupture test, in a state that the memory card 1A ismounted on a test device, static electricity is applied to the memorycard 1A from a back-face side. In the full-size memory card, withrespect to the structure in which the base substrate and the cap havethe substantially same plane dimensions, the base substrate is formedsuch that the base substrate extends to a position close to theback-face side of the memory card and hence, the distance of aconductive path from the back-face side of the memory card to the chipat the frontal side is short. On the contrary, the memory card 1A ofthis embodiment 4 is formed of the insulating cap 16 which extends fromthe back face thereof to the longitudinally approximately half positionand hence, the distance of a conductive path from the back-face sidethereof to the frontal face side chip is long whereby the full-sizememory card 1A exhibits the structure which is difficult to be rupturedby the electrostatic rupture test.

Further, in the full-size memory card 1A, the structure having theplanar dimensions of the base substrate set to approximately one half ofthe planar dimensions of the cap 16 can reduce the area of the basesubstrate 4 and the volume of the sealing resin 11 compared to thestructure in which the base substrate and the full-size capsubstantially have the same planar dimensions. Accordingly, it ispossible to make the full-size memory card 1A light-weighted.Particularly, since the memory card 1A of the embodiment 4 has, asmentioned above, the corner portions of the base substrate 4 chamfered,the reduction of weight can be enhanced. Accordingly, the portability ofthe full-size memory card 1A can be enhanced.

FIG. 30 to FIG. 32 are explanatory views showing the result of bendingrupture strength test of the memory card 1A shown in FIG. 23. In thememory card 1A having such a structure, it is understood that thebending rupture strength is dropped sharply and in a rectangular shapeat a boundary portion (positions b3, b4) between the base substrate 4and the cap 16 which is disposed at the approximately longitudinalcenter of the cap 16. Here, symbols b1 to b4 are given to indicatepositions for facilitating the understanding of the positionalrelationship between them in FIG. 30 to FIG. 32.

On the other hand, FIG. 33 to FIG. 35 are explanatory views showing theresult of bending rupture strength test of the memory card 1A shown inFIG. 28 and the like of this embodiment 4. In the memory card 1A of thisembodiment 4, it is understood that the drop of the bending rupturestrength at a boundary portion (positions b5, b6, b4) between the basesubstrate 4 and the cap 16 which is disposed at the approximatelylongitudinal center of the cap 16 is made relatively gentle and theminimum value is higher than the minimum value in the case of FIG. 31and FIG. 32. That is, this embodiment 4 can enhance the bending rupturestrength of the full-size memory card 1A.

Subsequently, the definition on dimensions and the like of the full-sizememory card 1A of this embodiment 4 are explained hereinafter inconjunction with FIG. 36 and FIG. 37.

FIG. 36 is a plan view of the rear surface of the cap 16 of thisembodiment 4. The length in the lateral direction of the groove 16 d(that is, substantially the dimension in the lateral direction of thebase substrate 4) X1 is set smaller than one half of the total length X2in the longitudinal direction of the cap 16 (X1<X2/2). This setting ismade so as to enable the common use of the base substrate 4 in both ofthe full-size mode and the half-size mode. That is, when the width X1 isset equal to or longer than one half of the total length X2, the basesubstrate cannot be used in the half-size memory card 1 which has beenexplained in conjunction with the above-mentioned embodiment 1. Thelength X1 is approximately 114.5 mm, for example, and the total lengthX2 is approximately 32 mm, for example.

Further, in this embodiment 4, at the chamfered portions 16 b 4, 16 b 5,the length X3 in the longitudinal direction of the cap 16 is set equalto the length Y1 in the lateral direction of the cap 16 (X3=Y1).Accordingly, an angle θ is set to approximately 45°. This is becausethis setting can enhance the bending rupture strength at the cornerportion regions as a whole theoretically. Further, according to thestudies carried out by the inventors, a favorable result was obtained onthe bending rupture strength even when the relationship is set to Y1>X3.The lengths X3, Y1 are approximately 2 mm, for example.

Further, the length L2 of the chamfered portion 16 a is set longer thanthe lengths X3, Y1 (L2>X3, Y1). This is because when the lengths X3, Y1are set excessively large, the area of the base substrate 4 is madeexcessively small and hence, the chip cannot be mounted on the basesubstrate 4. The length L2 is set to 5.66 mm, for example.

Further, these lengths X3, Y1 are set larger than the thicknesses d8,d9, d10 (X3, Y1>d8, d9, d10). This is because when the lengths X3, Y1are set smaller than the thicknesses d8 to d10, a chamfered amountbecomes excessively small so that it is difficult to sufficiently obtainthe above-mentioned bending rupture strength. The thickness d8 isapproximately 1 mm, for example, and the thicknesses d9, d10 areapproximately 0.6 mm, for example.

Further, FIG. 37 is an enlarged cross-sectional view of an essentialpart of the memory card 1A of this embodiment 4. The total thickness ofthe memory card 1A corresponds to the thickness d11 of the cap 16. Thisthickness d11 is equal to or more than the thickness of d12 (d11>d12).The thickness d12 is a thickness from the front surface of the cap 16 tothe rear surface of the base substrate 4. The reason that the dimensionis set in the above-mentioned manner is that when the thickness d12becomes greater than the thickness d11, the memory card 1A cannotconform with the Standard of the memory card. The depth d13 indicates adepth of the groove 16 b. The thickness d11 is approximately 1.4 mm, forexample. The thickness d12 is equal to or less than 1.4 mm, for example.The depth d13 is approximately 1.04 mm, for example, and the thicknessd14 is approximately 0.28 mm, for example.

Subsequently, one example of a mold which is used for forming the cap 16for full-size use shown in FIG. 26 to FIG. 29 and the like is explainedin conjunction with FIG. 38. FIG. 38 is a cross-sectional view of themold 15. The structure of the mold 15 is substantially equal to thatwhich has been explained in conjunction with FIG. 11 and FIG. 12 (a),(c) of the above-mentioned embodiment 1. The difference lies in that thelongitudinal length of the cavity 15 c is set longer than thelongitudinal length of the cavity explained in conjunction with FIG. 15.That is, the length of the portion extending from the approximatelylongitudinal center of the cavity 15 c to a portion where the back faceportion of the cap 16 is formed is set longer than the length of thecorresponding portion shown in FIG. 11 and FIG. 12.

Subsequently, an example of layout of the chip on the base substrate 4of this embodiment 4 is explained in conjunction with FIG. 39 and FIG.40. FIG. 39 and FIG. 40 are plan views of the front surface (partmounting surface) of the base substrate 4 in this embodiment 4.

In this embodiment 4, on the front surface of the base substrate 4, onechip 5 a for memory and one chip 5 b for controller are mounted. Thesechips 5 a, 5 b are arranged in parallel along the longitudinal directionof the base substrate 4 (that is, the direction along which a pluralityof external connection terminals 9 (see FIG. 25 and FIG. 28) arearranged). The relatively large chip 5 a for memory is arranged at aposition apart from the chamfered portion 4 a at the index side. On theother hand, the relatively small chip 5 b for controller is arranged ata side close to the chamfered portion 4 a at the index side. Due to suchan arrangement, it is possible to realize a memory card of largecapacity having a compact configuration.

In the above-mentioned chip 5 a for memory, a memory circuit of a memorycapacity of 16M, 32 bytes, for example, is formed. The chip 5 a formemory has a shape closer to square than the chip 5 b for controller.The length L3 of one side of the chip 5 a for memory is set greater thanthe length L4 of one side which extends in the longitudinal direction ofthe chip 5 b for controller. In the vicinity of one side on a mainsurface of the chip 5 a for memory, a plurality of bonding pads 20 a arearranged along this one side. The chip 5 a for memory is mounted suchthat one side on which a plurality of bonding pads 20 a are arranged isarranged at longitudinally center side of the base substrate 4, that is,at the side of the chip 5 b for controller. These bonding pads 20 a areelectrically connected with wiring on the front surface of the basesubstrate 4 through bonding wires 6.

On the other hand, on a main surface of the chip 5 b for controller, inthe vicinity of two long sides, a plurality of bonding pads 20 b arearranged along these long sides. The chip 5 b for controller is mountedon the front surface of the base substrate 4 such that the long sidesthereof are arranged substantially parallel to one side along which aplurality of bonding pads 20 a of the chip 5 a for memory are arranged.These bonding pads 20 b are electrically connected to wiring on thefront surface of the base substrate 4 through the bonding wires 6. Suchan arrangement of the chips 5 a, 5 b is also applicable to theabove-mentioned embodiments 1 to 3.

A metal layer 21 formed of gold plating or the like is formed on thefront surface of the base substrate 4 at a longitudinal distal end side(at a side where the chamfered portion 4 a is formed). The metal layer21 constitutes a portion where a gate of a mold is arranged at the timeof sealing the chips 5 a, 5 b. That is, in forming the sealing resin 11(See FIG. 29 and the like), resin is made to flow toward the regionwhere the chip 5 a for memory is arranged through the region where thechip 5 b for controller is arranged from the metal layer 21 side.

Subsequently, one example of an assembling method of the semiconductordevice of this embodiment 4 is explained. The assembling steps are equalto the steps which have been explained in conjunction with FIG. 13 whichshows the previous embodiment 1. Here, the assembling steps areexplained in conjunction with FIG. 42 to FIG. 46 along a flow chartshown in FIG. 41. Here, FIG. 42 to FIG. 46 are plan views of the frontsurface of the base substrate 4 during the assembling steps.

First of all, a base substrate forming body 22 shown in FIG. 42 isprepared. A plurality of base substrates 4 are already connected to aframe body 22 a of the base substrate forming body 22 by way of minuteconnecting portions 22 b which are connected to two short-side centersof respective base substrates 4. At this stage, the frame body 22 a, theconnecting portions 22 b and the base substrates 4 are integrallyformed. Further, the chamfered portions 4 b, 4 c of the base substrate 4are already formed. Subsequently, as shown in FIG. 43, the chip 5 a, 5 bare mounted on the front surface of each base substrate 4 of the basesubstrate forming body 22 (step 100 in FIG. 41). Here, the relativelylarge chip 5 a for memory is mounted at a position apart from thechamfered portion 4 a and the relatively small chip 5 b for controlleris mounted at a position close to the chamfered portion 4 a. Thereafter,to clean surfaces of the wiring and electrodes (including bonding pads20 a, 20 b) of the base substrates 4 and the chips 5 a, 5 b, the plasmacleaning treatment is applied, for example (step 101 of FIG. 41). Themain purpose of this step lies in that by cleaning the front surfaces ofthe gold plating layer which is thinly formed, the favorable connectionstate of the wires and metal plating layer is achieved in a bonding wirestep which follows this step.

Subsequently, as shown in FIG. 44, on each base substrate 4, the bondingpads 20 a, 20 b of the chips 5 a, 5 b are electrically connected to thewiring and the electrodes of the base substrate 4 through the bondingwires 6 (step 102 in FIG. 41). Then, as shown in FIG. 45, in each basesubstrate 4, the chips 5 a, 5 b and the bonding wires 6 and the like aresealed using a transfer mold (step 103 in FIG. 41). After completion ofthe above mentioned wire bonding step and before starting a moldingstep, the above-mentioned cleaning treatment may be applied to the basesubstrate 4 from a viewpoint of enhancement of the adhesive property ofthe sealing resin 11. Thereafter, as shown in FIG. 46, the connectingportions 22 b are cut so that the base substrates 4 are separated fromthe base substrate forming body 22 (step 104 in FIG. 41). In thismanner, the base substrates 4 are formed.

Then, in manufacturing the full-size (FS) memory card 1A, theabove-mentioned base substrate 4 is mounted in the inside of the groove16 of the cap 16 shown in FIG. 26 and FIG. 27 and is fixed thereto usingan adhesive agent or the like (step 105A in FIG. 41). On the other hand,in manufacturing the half-size (HS) (or reduced size (RS)) memory card1, the base substrate 4 is mounted in the inside of the groove formed onthe rear surface of the cap 3 which is explained in conjunction withFIG. 1 to FIG. 5 and the like of the previously mentioned embodiment 1(the planar shape of such a groove being formed in the shape explainedin conjunction with FIG. 27 to FIG. 29) and is fixed thereto by anadhesive agent or the like (step 105B in FIG. 41).

In this manner, according to this embodiment, two types of memory cards1, 1A of full size and half size can be manufactured using one basesubstrate 4. That is, the manufacturing steps and members for thefull-size and half-size memory cards 1, 1A can be partially used incommon and hence, the manufacturing steps can be simplified and themanufacturing time is shortened and the manufacturing cost can bereduced compared to a case in which the memory cards 1, 1A areseparately manufactured.

Embodiment 5

In this embodiment 5, in a full-size memory card in which the planardimensions of the base substrate is set approximately one half of theplanar dimensions of the cap, a modification having a structure whichcan enhance the above-mentioned bending rupture strength is explained.

FIG. 47 is a plan view of a rear surface-side in the full-size memorycard 1A of this embodiment 5 and FIG. 48 is an enlarged plan view of aregion Z1 in FIG. 47. In this embodiment 5, on the base substrate 4,minute indentations and projections 4 d having a rectangular shape areformed in the vicinity of both corner portions positioned at thelongitudinal center side of the full-size cap 16, while minuteindentations and projections 16 b 7 having a rectangular shape are alsoformed in the vicinity of corner portions of the groove 16 b of the cap16 correspondingly such that these indentations and projections 16 b 7can be snuggly fitted into the minute indentations and projections ofthe base substrate 4. These minute indentations and projections 4 b, 16b 7 are formed to have a left-and-right symmetry in FIG. 47. Except forthe above-mentioned constitutions, the other constitutions of thisembodiment are equal to those which have been explained in conjunctionwith the above-mentioned embodiments 1 to 4. The above-mentionedindentations and projections 4 d, 16 b 7 may be formed on the long side16 b 2 of the groove 16 b and the long side of the base substrate 4corresponding to the long side 16 b 2 of the groove 16 b.

Also in this embodiment 5, it is possible to increase the contact areabetween the base substrate 4 and the cap 16 at the corner portions whichexhibit relatively weak strength and hence, the occurrence of cracks onthe cap 16 and the peeling-off of the base substrate 4 can be suppressedor prevented so that the above-mentioned bending rupture strength can beenhanced.

Embodiment 6

In this embodiment 6, in a full-size memory card in which the planardimensions of the base substrate are set approximately one half of theplanar dimensions of the cap, another modification having a structurewhich can enhance the above-mentioned bending rupture strength isexplained.

FIG. 49 is a plan view of a back surface-side of a full-size memory card1A of this embodiment 6 and FIG. 50 is an enlarged plan view of a regionZ2 in FIG. 49. Also in this embodiment 6, in the same manner as theabove-mentioned embodiment 5, in the vicinity of corner portions of thebase substrate 4 and in the vicinity of corner portions of a groove 16 bof a cap 16 corresponding to the base substrate 4, minute indentationsand projections 4 d, 16 b 7 are formed. The difference between thisembodiment 6 and the above-mentioned embodiment 5 lies in that sidefaces of respective minute indentations and projections 4 d, 16 b 7 aretapered. In this case, the fitting engagement between the minuteindentations and projections 4 d of the base substrate 4 and the minuteindentations and projections 4 d of the groove 16 b of the cap 16 isfacilitated compared to the case explained in conjunction with theabove-mentioned embodiment 5. Except for the above-mentionedconstitutions, the other constitutions of this embodiment are equal tothose which have been explained in conjunction with the above-mentionedembodiments 1 to 4. The above-mentioned indentations and projections 4d, 16 b 7 may be formed on the long side 16 b 2 of the groove 16 b andthe long side of the base substrate 4 corresponding to the long side 16b 2 of the groove 16 b.

Embodiment 7

In this embodiment 7, in a full-size memory card in which the planardimensions of the base substrate are set approximately one half of theplanar dimensions of the cap, still another modification having astructure which can enhance the above-mentioned bending rupture strengthis explained.

FIG. 51 is a plan view of a back surface-side of a full-size memory card1A of this embodiment 7. With respect to this embodiment 7, on the basesubstrate 4, along a long side which is positioned at the longitudinallycenter side of the full-size cap 16 and in the vicinity of both cornerportions of lateral sides which cross the long side at a right angle,minute indentations and projections 4 d in a serrated shape are formed,while minute indentations and projections 16 b 7 having a serrated shapeare formed along a long side and short sides of a groove 16 b of a cap16 corresponding to the minute indentations and projections 4 d suchthat the minute indentations and projections 4 d, 16 b 7 can be snugglyfitted into each other. Except for the above-mentioned constitutions,the other constitutions of this embodiment are equal to those which havebeen explained in conjunction with the above-mentioned embodiments 1 to4. Also in this embodiment 7, it is possible to obtain an advantageouseffect with respect to the bending rupture strength similar to theadvantageous effects obtained by the above-mentioned embodiments 4 to 6.

Embodiment 8

In this embodiment 8, a half-size memory card which uses the basesubstrate shown in the previous embodiment 4 in conjunction with FIG. 24and FIG. 25 and the like is explained.

FIG. 52 and FIG. 53 respectively show plan views of a front surface-sideand a rear surface-side of the half-size memory card 1 of thisembodiment 8. At a frontal face of a cap (second case body) 3 of thememory card 1, a corner of one corner portion is eliminated thus formingthe above-mentioned chamfered portion 3 e at the index side. Thischamfered portion 3 e is provided from a viewpoint of facilitating therecognition of the mounting direction of the memory card 1 and the like.Further, on the front surface of the cap 3, at the chamfered portion 3 eside, a mark 3 d 2 having an arrow shape which extends from a back faceto the frontal face of the memory card 1 is formed. This mark 3 d 2indicates the inserting direction when the memory card 1 is insertedinto the above-mentioned electronic device. With respect to thehalf-size memory card 1 of this embodiment 8, the memory card 1 isinserted into the electronic device using a distal end thereof in thelateral direction as the frontal face. However, in general, there existsa fixed or stereotyped idea that the memory card is inserted into theelectronic device using a distal end in the longitudinal direction as afrontal face. Accordingly, to prevent an erroneous insertion, therelatively large mark 3 d 2 is displayed on the memory card 1. Further,a shallow groove 3 f having a planar quadrangular shape is formed on thefront surface of the cap 3 in a region apart from the chamfered portion3 e. This shallow groove 3 f constitutes a region to which a seal whichdescribes the content of recorded data of the memory card 1 or the likeis laminated.

Further, on the rear surface of the cap 3 of this embodiment 8, a groove(second groove) 3 g having a planar shape equal to that of the basesubstrate 4 and a planar dimensions which are slightly larger than thebase substrate 4 is formed to enable the neat fitting of the basesubstrate 4 shown in FIG. 24 and FIG. 25 into the groove 3 g (secondgroove). Accordingly, with respect to the groove 3 g in this case, along side 3 g 1 at a side in the vicinity of the back-face of the memorycard 1 and two lateral sides 3 g 2, 3 g 2 of the groove 3 g do not crosseach other at a right angle and the portions where the long side 3 g 1and the short sides 3 g 2, 3 g 2 originally cross each other havecorners thereof eliminated so that the chamfered portions (firstchamfered portions) 3 g 3, 3 g 4 are formed. The structure (includingthe chamfered portions 3 g 3, 3 g 4) of this groove 3 g is equal to thestructure of the groove 16 b of the full-size cap 16 which has beenexplained in the above-mentioned embodiment 4. Due to such aconstitution, the base substrate 4 is applicable to both of thefull-size memory card and the half size memory card. Further, themounting state of the base substrate 4 on the groove 3 g is equal to thecorresponding mounting state which is explained in conjunction with theabove-mentioned embodiment 4. Further, the above-mentioned grooveportion 3 b 2 formed on the rear surface of the cap 3 also functions asa catching or hooking groove when the memory card 1 is removed from theelectronic device.

Embodiment 9

In this embodiment 9, an example which can cope with a case in which thenumber of external connection terminals 9 formed on a back surface of amemory card is changed due to the change of the Standard of memory cardis explained.

FIG. 54 illustrates a case in which the number of external connectionterminals in the memory card 1 of this embodiment 9 is registered withthe number of external connection terminals of a SD card (Panasonic,Toshiba limited, Sun Disk Inc.). On a rear surface-side of the memorycard 1 (rear surface of the base substrate 4), nine pieces of externalconnection terminals 9 in total are arranged. Further, FIG. 55illustrates a case in which the number of external connection terminals4 in the memory card 1 of this embodiment 9 is registered with thenumber of external connection terminals of an IC card. On the rearsurface-side of the memory card 1 (rear surface of the base substrate4), thirteen pieces of external connection terminals 9 in total arearranged, wherein these external connection terminals 9 are arranged intwo rows partially. In both cases, this embodiment 9 can cope with thechange of the Standard of memory without giving rise to any problem.

Embodiment 10

In this embodiment 10, in a full-size memory card in which the planardimensions of the base substrate are set approximately one half of theplanar dimensions of the cap, still another modification having astructure which can enhance the above-mentioned bending rupture strengthis explained.

FIG. 56 is a cross-sectional view of a full-size memory card 1A of thisembodiment 10 and FIG. 57 is an enlarged cross-sectional view of anessential part in FIG. 56. In this embodiment 10, an eaves portion 16 iis integrally formed on a long side 16 b 2 of a groove 16 b of a cap 16.The eaves portion 16 i may be extended along the long side 16 b 2 or maybe scattered at portions of the long side 16 b 2. In this manner, with aprovision of the eaves portion 16 i (that is, by providing a reinforcingmember), a recessed portion 16 j is formed on a side face at the longside 16 b 2 of the groove 16 b. By having a portion of a back-face sideof the base substrate 4 fitted into the inside of this recessed portion16 j, this embodiment 10 provides a structure which can firmly fix thebase substrate 4. Here, to have the base substrate 4 fitted into therecessed portion 16 j, the portion of the back-face side of the basesubstrate 4 is made thin by half etching. Due to such a structure, it ispossible to enhance the above-mentioned bending rupture strength so thatthe peeling-off of the base substrate 4 and the rupture of the cap 16can be suppressed or prevented. When the structure of this embodiment 10is adopted, it may be unnecessary to provide chamfered portions 16 b 4,16 b 5 to the groove 16 b. However, it is possible to enhance thebending rupture strength by providing the chamfered portions 16 b 4, 16b 5. Further, in this case, the eaves portions 16 i may be formed at thechamfered portions 16 b 4, 16 b 5.

Although the invention which has been made by the inventors has beenspecifically explained based on the embodiments heretofore, it isneedless to say that the present invention is not limited to theabove-mentioned embodiments and various modifications can be madewithout departing from the gist of the present invention.

For example, the shape and the number of supporting portions of theadapter are not limited to those of the above-mentioned embodiments andvarious modifications can be made.

Further, the chips can adopt a connection method which uses bumpelectrodes besides the connection based on the wire bonding method.

Although the present invention made by the inventors has been explainedmainly with respect to the case in which the invention is applied to thememory card incorporating a flash memory (EEPROM) which constitutes thetechnical field of the background of this invention heretofore, thepresent invention is not limited to such a memory card and is applicableto a memory card incorporating other memory circuit such as SRAM (StaticRandom Access Memory), FRAM (Ferroelectric Random Access Memory) or MRAM(Magnetic Random Access Memory). Further, the present invention is alsoapplicable to an IC (Integrated Circuit) card having no memory circuit.

To briefly recapitulate the advantageous effects obtained by oneembodiment of the present invention, they are as follows.

That is, by providing the mounting portion having a projecting crosssection on which the recessed portion of the metal-made auxiliary piecefor increasing the planar dimension of the case body is fitted to theportion of the case body which incorporates the semiconductor chiptherein, the versatility of the semiconductor device can be enhanced.

Further, by chamfering corner portions which are positioned at the casebody center side with respect to the substrate and the groove of thecase body in which the substrate is mounted, the bending rupturestrength of the semiconductor device can be enhanced.

INDUSTRIAL APPLICABILITY

The present invention is applicable to the semiconductor device and themanufacturing method thereof.

1-48. (canceled)
 49. A memory card comprising: a substrate; a firstflash memory chip mounted over said substrate; a controller chip forsaid first flash memory chip mounted over said substrate; a card bodycovering said substrate, said first flash memory chip and saidcontroller chip; wherein said memory card is capable of being connectedto an adapter, wherein planar dimensions of said memory card withoutsaid adapter are smaller than the dimensions (32 mm×24 mm) and are setto the dimensions (32 mm×24 mm) when connected to said adapter, andwherein a planar area of said first flash memory chip is larger thanthat of said controller chip.
 50. A memory card according to claim 49,further comprising a second flash memory chip.
 51. A memory cardaccording to claim 50, wherein said second flash memory chip is stackedover said first flash memory chip.
 52. A memory card according to claim49, wherein said card body has portions for connecting to said adapter.53. A memory card according to claim 52, wherein said portions forconnecting to said adapter are dents formed at corner portions of saidcard body.
 54. A memory card according to claim 53, wherein said dentsare formed at front and rear surfaces of said card body, the width ofsaid dents formed at said front surface is larger than the width of saiddents formed at said rear surface.
 55. A memory card according to claim49, wherein a thickness of said memory card is set to 1.4 mm.
 56. Amemory card according to claim 55, wherein the length of long sides ofsaid memory card is set to 24 mm, and wherein the length of short sidesof said memory card is set to 18 mm.
 57. A memory card according toclaim 49, further comprising a plurality of external terminals on saidsubstrate, said external terminals including a CLK terminal, a DATterminal, and a CMD terminal.
 58. A memory card according to claim 57,wherein the number of said external terminals is
 7. 59. A memory cardaccording to claim 57, wherein the number of said external terminals is9.
 60. A memory card according to claim 57, wherein the number of saidexternal terminals is
 13. 61. A memory card according to claim 57,wherein said external terminals are arranged in two rows.
 62. A memorycard according to claim 49, further comprising a sealing member coveringsaid substrate, said first flash memory chip, and said controller chip.63. A memory card according to claim 62, wherein said sealing member isformed of resin that is different from resin of which said card body isformed.
 64. A memory card according to claim 63, wherein said resin ofsaid sealing member is epoxy-based resin.
 65. A memory card according toclaim 63, wherein said resin of said card body is ABS resin or PPE (PolyPhenylen Ether).
 66. A memory card according to claim 49, furthercomprising terminals for testing a circuit arranged on a rear surface ofsaid substrate.
 67. A memory card according to claim 49, furthercomprising terminals for adding functions arranged on a rear surface ofsaid substrate.
 68. A memory card according to claim 49, wherein saidsubstrate has a planar area which is equal to or less than one half of aplanar area of said card body.
 69. A memory card comprising: asubstrate; a first flash memory chip mounted over said substrate; acontroller chip for said first flash memory chip mounted over saidsubstrate; a card body covering said substrate, said first flash memorychip and said controller chip; wherein said memory card is capable ofbeing attached to an adapter, wherein a planar size of said memory cardwithout said adapter is smaller than that of a full-size memory carddefined by the multi media card standard or the SD card standard,wherein a planar size of said memory card, when attached to saidadapter, is equivalent to that of a full-size memory card defined by themulti media card standard or the SD card standard, and wherein a planarsize of said flash memory chip is larger than that of said controllerchip.
 70. A memory card according to claim 69, wherein said planar sizeof said full-size memory card is the dimensions (32 mm×24 mm).
 71. Amemory card according to claim 69, further comprising a second flashmemory chip.
 72. A memory card according to claim 71, wherein saidsecond flash memory chip is stacked over said first flash memory chip.73. A memory card according to claim 69, wherein said card body hasportions for connecting to said adapter.
 74. A memory card according toclaim 73, wherein said portions for connecting to said adapter are dentsformed at corner portions of said card body.
 75. A memory card accordingto claim 74, wherein said dents are formed at front and rear surfaces ofsaid card body, the width of said dents formed at said front surface islarger than the width of said dents formed at said rear surface.
 76. Amemory card according to claim 69, wherein a thickness of said memorycard is set to 1.4 mm.
 77. A memory card according to claim 76, whereinthe length of long sides of said memory card is set to 24 mm, andwherein the length of short sides of said memory card is set to 18 mm.78. A memory card according to claim 69, further comprising a pluralityof external terminals on said substrate, said external terminalsincluding a CLK terminal, a DAT terminal, and a CMD terminal.
 79. Amemory card according to claim 78, wherein the number of said externalterminals is
 7. 80. A memory card according to claim 78, wherein thenumber of said external terminals is
 9. 81. A memory card according toclaim 78, wherein the number of said external terminals is
 13. 82. Amemory card according to claim 78, wherein said external terminals arearranged in two rows.
 83. A memory card according to claim 69, furthercomprising a sealing member covering said substrate, said first flashmemory chip, and said controller chip.
 84. A memory card according toclaim 83, wherein said sealing member is formed of resin that isdifferent from resin of which said card body is formed.
 85. A memorycard according to claim 84, wherein said resin of said sealing member isepoxy-based resin.
 86. A memory card according to claim 84, said resinof said card body is ABS resin or PPE (Poly Phenylen Ether).
 87. Amemory card according to claim 69, further comprising terminals fortesting a circuit arranged on a rear surface of said substrate.
 88. Amemory card according to claim 69, further comprising terminals foradding functions arranged on a rear surface of said substrate.
 89. Amemory card according to claim 69, wherein said substrate has a planararea which is equal to or less than one half of a planar area of saidcard body.
 90. A memory card comprising: a substrate; a plurality offlash memory chips mounted over said substrate; a controller chip forsaid flash memory chips mounted over said substrate; a card bodycovering said substrate, said flash memory chips and said controllerchip; wherein said memory card is capable of being connected to anadapter, wherein planar dimensions of said memory card without saidadapter are smaller than the dimensions (32 mm×24 mm) and are set to thedimensions (32 mm×24 mm) when connected to said adapter, and wherein aplanar area of a first flash memory chip of said plurality is largerthan that of said controller chip.
 91. A memory card according to claim90, wherein one of said flash memory chips is stacked over other of saidflash memory chips.
 92. A memory card according to claim 90, whereinsaid card body has portions for connecting to said adapter.
 93. A memorycard according to claim 92, wherein said portions for connecting to saidadapter are dents formed at corner portions of said card body.
 94. Amemory card according to claim 93, wherein said dents are formed atfront and rear surfaces of said card body, the width of said dentsformed at said front surface is larger than the width of said dentsformed at said rear surface.
 95. A memory card according to claim 90,wherein a thickness of said memory card is set to 1.4 mm.
 96. A memorycard according to claim 95, wherein the length of long sides of saidmemory card is set to 24 mm, and wherein the length of short sides ofsaid memory card is set to 18 mm.
 97. A memory card according to claim90, further comprising a plurality of external terminals on saidsubstrate, said external terminals including a CLK terminal, a DATterminal, and a CMD terminal.
 98. A memory card according to claim 97,wherein the number of said external terminals is
 7. 99. A memory cardaccording to claim 97, wherein the number of said external terminals is9.
 100. A memory card according to claim 97, wherein the number of saidexternal terminals is
 13. 101. A memory card according to claim 97,wherein said external terminals are arranged in two rows.
 102. A memorycard according to claim 90, further comprising a sealing member coveringsaid substrate, said flash memory chips, and said controller chip. 103.A memory card according to claim 102, wherein said sealing member isformed of resin that is different from resin of which said card body isformed.
 104. A memory card according to claim 103, wherein said resin ofsaid sealing member is epoxy-based resin.
 105. A memory card accordingto claim 103, wherein said resin of said card body is ABS resin or PPE(Poly Phenylen Ether).
 106. A memory card according to claim 90, furthercomprising terminals for testing a circuit arranged on a rear surface ofsaid substrate.
 107. A memory card according to claim 90, furthercomprising terminals for adding functions arranged on a rear surface ofsaid substrate.
 108. A memory card according to claim 90, wherein saidsubstrate has a planar area which is equal to or less than one half of aplanar area of said card body.